Semiconductor Soldering

Sonic4Lab active solder and associated processing can join many materials from aluminum and copper to silicon and a range of ceramics and carbides.

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Sputter Target Bonding

Ultrasonic soldering iron is a new type of ultrasonic welding tool that firmly combines solder with the surface of the welded object through ultrasonic vibration.

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Solar Power Panel Bonding

Ultrasonic soldering iron has been proven for silicon bonding and joining PV coated glass to metallic conductors.

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