Sputtered target material is a commonly used material in the field of thin film preparation, which refers to the process of making various materials (such as metals, ceramics, alloys, etc.) into discs or square plates, and then physically coating them by placing them in a vacuum or inert gas environment to achieve the formation of a pure, dense, and uniform thin film on the surface of the substrate. The quality, performance, and lifespan of sputtering target materials are closely related to the welding method.

Ultrasonic soldering iron is a new type of ultrasonic welding tool that firmly combines solder with the surface of the welded object through ultrasonic vibration. It is widely used in the welding between metal and non-metal materials, such as glass, ceramics, silicon crystal devices (LED, LCD, etc.), superconducting material precision welding, electronic product packaging, etc. There is no need to use flux during use (ultrasonic tool head vibration and removal of all surface dirt or oxide layers).