The ultrasonic soldering iron consists of a high performance sheath heater and transducer, supplying heat and ultrasonic oscillations to the tip. The ultrasonic soldering is implemented by the cavitation effect which breaks the oxide surface and eliminates bubbles in solder. Using the solder alloy, can easily solder directly to glass, ceramics and other low solderability materials. It has been widely used in soldering solar cell, LED, ITO glass etc.
- No surface pre-treatment required
- No flux, therefore, no post cleaning
- Gas-tight and heat-resistant up to 250°C
- Solder materials: glass, ceramics, aluminum, steel etc
- Stronger non-porous bonds between solder and material
- Compressed air for cooling the transducer