How Our Soldering Works
Ultrasonic soldering is a specialized soldering process that eliminates the need for chemical flux. In place of flux, it uses acoustic energy to disrupt oxides that form on molten solder and base metal surfaces during the joining process.
Many times ultrasonic soldering is used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics and dissimilar materials. Applications include electronics, medical decives, and structural components, in various base metal combinations, such as copper, aluminum, and titanium, graphite, carbides and more.
A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this.
A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond. Coating a ceramic with solder is an example of this process.
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When to use Ultrasonic Soldering
There are two main reasons for using Ultrasonic Soldering:
1. To eliminate the need for flux in the soldering process
2. To apply solder to ceramics and similar materials
The advantages of removing flux from the process are that there is no need for post-process cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of eliminating wicking is that the solder coating on the base material can be better controlled.
About Us
Sonic4Lab was founded to ultrasonic instruments including ultrasonic soldering iron, ultrasonic impact treatment, ultrasonic knife and so on. Our customers are Research and Development laboratories and companies for production applications. We use state-of-the-art equipment and in-depth experience to develop accessible solutions for emerging applications.
