Solder Alloy
Sonic4Lab solder formulations bond without the use of flux or preplating and are lead and cadmium free and conform to the requirements of all lead free solder initiatives (RoHS, etc.).
Sonic4Lab solder alloy enables bonding to previously low-solderability materials, such as glass, ceramic substrates, aluminum, tungsten, molibdenum and titanium thanks to its special elements and Sonic4Labʼs ultrasonic soldering technology.
About Us
Sonic4Lab was founded to ultrasonic instruments including ultrasonic soldering iron, ultrasonic impact treatment, ultrasonic knife and so on. Our customers are Research and Development laboratories and companies for production applications. We use state-of-the-art equipment and in-depth experience to develop accessible solutions for emerging applications.
