As electronic devices rapidly evolve towards higher power and miniaturization, connection technology, as a core supporting element, directly determines the overall performance and reliability of the devices. Among these, the connection process between copper clips/copper sheets and the chip surface has become a key breakthrough in overcoming power density bottlenecks. Ultrasonic welding technology, with its unique advantages, is gradually replacing traditional processes in such connection scenarios, injecting strong momentum into the development of high-power-density devices.
The core requirements of high-power-density devices for connection processes focus on two dimensions: low resistance and efficient heat dissipation. With the increase in device power, the heat generated per unit volume increases dramatically. If the resistance at the connection point is too high, it will not only cause significant energy loss but also lead to device performance degradation or even failure due to localized overheating. Traditional wire bonding processes have gradually shown limitations when facing high-power demands. The thin wire connection method used has a limited conductive cross-sectional area, making it difficult to further reduce resistance. At the same time, the heat transfer path is narrow, and the heat dissipation efficiency is difficult to match the operating requirements of high-power-density devices.
The emergence of ultrasonic welding technology precisely solves this industry pain point. This technology uses high-frequency mechanical vibration to plastically deform the metal contact area between the copper clip/sheet and the chip surface, simultaneously removing the oxide layer and impurities from the contact surface. This achieves a tight bond between metal atoms, forming a robust metallurgical joint. Compared to wire bonding, ultrasonic welding of copper clips/sheets offers a larger conductive cross-sectional area, reducing resistance by over 30%, significantly minimizing energy loss during conduction, and improving device energy efficiency.
Regarding heat dissipation, the joint formed by ultrasonic welding exhibits excellent thermal conductivity. The large metallurgical bonding surface creates an efficient heat dissipation path, rapidly transferring heat generated during chip operation to the copper clip/sheet, which is then dissipated through subsequent heat dissipation structures. Data shows that the copper clip connection solution using ultrasonic welding improves heat dissipation efficiency by approximately 40% compared to traditional wire bonding, effectively controlling chip operating temperature, extending device lifespan, and providing crucial support for the stable operation of high-power-density devices.
In addition to the core advantages of low resistance and superior heat dissipation, ultrasonic welding also boasts numerous other advantages, including fast welding speed, no flux required, high joint stability, and minimal chip damage. Its welding process requires no high-temperature heating, avoiding damage to the delicate internal structure of the chip caused by high temperatures. It is compatible with various specifications of copper clips/sheets for connection and is widely used in high-power-density electronics fields such as power modules for new energy vehicles, industrial control chips, and high-end power supply devices.
In the future, through process optimization and equipment upgrades, ultrasonic welding technology will further improve connection accuracy and stability, providing stronger technical support for the research and development and production of higher power-density devices, and driving the electronics industry towards continuous development towards high efficiency, miniaturization, and long lifespan.
